Senshuo technology silicon Rod customization process
عملية الإنتاج
Charging furnace
Polysilicon material and impurities are put into a quartz crucible, and the type of impurities depends on the N or Ptype of resistance.
Charging process
The furnace is closed and pumped into high purity Argon to maintain a certain pressure range. The graphite heater power supply is turned on and the polysilicon material is melted by heating 1420°。
Necking growth
After the temperature of the silicon melt stabilized, the seed crystal was immersed into the silicon melt slowly. Because of the thermal stress of the seed crystal in contact with the silicon melt field, dislocation would occur in the seed crystal.
Free-standing growth
After growing the thin neck, ال
temperature and the pulling speed are lowered, so that the crystal gradually increases to the required size.
Equal diameter growth
After the neck and shoulder are long, the diameter of the Rod can be kept positive or negative 3MM by adjusting the speed and temperature.
Final Cooling
The diameter of the crystal rod is gradually reduced until it becomes a cusp to separate from the liquid level. The process is called tail growth.
CZ and FZ
Almost 90% of the silicon used in the semiconductor industry is grown by czochralski method。
تفاصيل المنتج
Wafer manufacturing in the semiconductor field, the technology content is quite high, the technical process requirements are very high
Certificate of competency
In strict accordance with the monocrystalline silicon production process, factory to provide certification.
شبه التلقائي آلة نفخ الزجاجة PET آلة صنع الزجاجة آلة صب الزجاجة آلة تصنيع الزجاجات PET مناسبة لإنتاج عبوات بلاستيكية وزجاجات PET بجميع الأشكال.
شهادة
Logistics Capability
تعريف عن الشركة
Dongguan Senshuo Technology Co., المحدودة. was established in 2010. It is a professional semiconductor material solution provider. It is committed to providing customers with comprehensive silicon wafer solutions, ranging from Dummy Wafer to test level. Silicon wafers (Test Wafer), silicon for discrete devices, silicon for integrated circuits, grinding silicon for special diodes and energy-saving lamp electronic rectifiers, silicon wafers for filter coating, إلخ. في نفس الوقت, we can also customize products according to customers’ special requirements. The size covers 4 inches to 12 inches, and can provide single-sided/double-sided polishing, thinning, cutting, MEMS and other processing services of semiconductor silicon wafers.
التعليمات
س: What is your main product? أ: Single Crystal Silicon Wafer with infrared Si substrate,double-sided polishing filter. س: كم من الوقت هو وقت التسليم الخاص بك? أ: عادة ما يستغرق 7-15 أيام العمل. س: هل تقدمون عينات? أ: We can provide samples of conventional virtual wafers, but the minimum order quantity for custom wafers is 25 قِطَع
